MRC603 Sputter Rates

Protocol

  1. Get 2 Silicon 6inch wafers. Wafers can be resused by etching away the deposited layer using the right chemical.
  2. Get the 6inch pallet and place one wafer in the top left position (TL) and one wafer in the bottom right position (BR)
  3. Use a sharpie pen to make marks @ 5 locations on each wafers: T, C, B, L, R
  4. Run the process
  5. With a swab and acetone, lift-off the sharpie pen ink and measure steps with the profilometer (XP200)
  6. Record data in Coral and on website

Chromium deposition

Recipe target: 2000A

Gas Power Pressure ScanSpeed PreSputt # scans Vacuum
1: Ar 2.15 kW 10mT 100cm/min 1min 5 8.0 e-7

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Date Time to Vac. Wafer T C B L R AVE UNIF
21/03/11 15min WaferTL 1713 1884 1788 1732 2098 1843 8.53%
21/03/11 15min WaferBR 1586 1986 1887 2375 2480 2062.8 17.74%

 

Aluminum Deposition

Recipe target: 2000A

Gas Power Pressure ScanSpeed PreSputt # scans Vacuum
1: Ar 2.57 kW 10mT 20cm/min 1min 1 8.0 e-7

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Date Time to Vac. Wafer T C B L R AVE UNIF
21/03/11 15min WaferTL 1951 2164 1758 2175 2108 2031.2 8.71%
21/03/11 15min WaferBR 2015 2033 2265 2147 2300 2152 6.04%