Material | Thick. Range | Deposition | Dry Etch | Wet Etching | ||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Tool | Dep rate | Doc | Tool | Etch Rate | Recipe | Mask | Doc | Tool | Etch rate | Solution | Mask | Doc | ||
Shipley S1805 | 0.5-1um | SiteCoater | N/A | PVATepla | 350W, 1mBar | Solvent | Acetone | |||||||
Shipley S1813 | 1.1-1.7um | SiteCoater | N/A | PVATepla | 350W, 1mBar | Solvent | Acetone | |||||||
AZ9245 | 3.5-9um | SiteCoater | N/A | Solvent | Acetone | |||||||||
SU8 neg. resist | 2-200µm | SiteCoater | N/A | |||||||||||
Polyimide | 1000-2500A | SiteCoater | N/A | AMAT P5K RIE | 300-350nm/min | polyimide (O2) | Resist (1:!) | yes | ||||||
Spin-on-glass | 1000-9000A | SiteCoater | N/A | yes | ||||||||||
PMMA | 50-300nm | Laurell | N/A | AMAT P5K RIE | 7200A/min | PMMA | 250nm Al | |||||||
Metals | ||||||||||||||
Titanium (Ti) | 0-5000A | Denton E14 | ~3A/s | yes | Metal Etch | HF:H2O2:H2O 1:1:20 | Resist | |||||||
0-5000A | MRC | |||||||||||||
Titanium Nitride (TiN) | 0-5000A | Denton E14 | 0.8A/s | no | AMAT P5K RIE | CF4 | Resist | Metal Etch | NH4OH:H2O2 | Resist | ||||
Gold (Au) | 0-5000A | Denton E14 | ~4A/s | yes | TFA Gold Etchant | 28A/s @ 25°C | KI/I2 based |
Resist | http://www.transene.com/au_etchant.html | |||||
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