JIPELEC JetFirst 200

Qualiflow Therm
JetFirst 200
Thermal Processes
Etch/Dep room
Wed, 07/31/2013
Coral Name: 
RTA processor for wafers up to 8 " Temperature range: ambient to 1300 °C Ramp rate: 1°C/s to 300 °C/s Gases available: N2, H2/N2 (forming gas), O2, Ar


Associated Documents and References

  • JETFIRST 200 Instruction Manual Revision 5.0
  • JETFIRST 200 Technical Manual Revision 1.0


Prior using the tool

  • Be sure that the materials on your sample are compatible with the temperature of the process you are planning to run.
  • Check the status in Coral or consult the website.
  • If you plan to use a temperature above 900 °C, contact the staff first. The thermocouples have to be moved down for process under pyrometer control.
Warning: Using a temperature higher than 1000 °C with the thermocouples will destroy them.


  • If the software is not already run, double-click the JestFirst icon on the desktop of the computer.
  • Click “Parameters” in the upper left corner to see the active temperature display. If "TC1" indicates 0, contact the staff.

Main menu

Sample loading

  • Lift-up the lid of the chamber

6 inch wafer inside the chamberThermocouple

  • If the substrate of your sample is not silicon (III-V, sapphire etc), replace the 6 inch silicon wafer by your own one to prevent any cross-contamination. Remove the current wafer and place carefully your wafer with your tweezers or fingers on the quartz pins.
  • Verify that the thermocouple is in contact with the wafer. If not, contact the staff.
  • If needed, use the nitrogen gun to remove particles inside the chamber.
  • Place your sample at the center of the wafer. It should be placed where the TC and the wafer are in contact.
  • Close and lock the chamber.
Warning: Be sure that your tweezers, gloves, wafer and sample are clean. Presence of polymer, wax or other materials will likely contaminate the chamber.

Creating/Editing a recipe

Recipe explorerEdit step

  • In the main interface, click "Recipes".
  • Select "Recipe example" in the explorer and click "Open".
  • Change the recipe name. Select the right pyrometer calibration table according to the size of the wafer and the subtrate material. As an option, comments can be entered.
  • Click "Edit" and the recipe edition interface will be displayed.
  • Press the button "Save recipe"
  • Change the parameters for each step.

Time: step duration from 0 to 9999 s. Do not exceed the following process durations: 

T<500 °C: 30 min

T<700 °C: 10 min

T<900°C: 5 min

T<1200 °C: 2 min

Temperature control mode: pyrometer, thermocouple or power.

Temperature setpoint: from 0 to 1300 °C.

Compensation coefficient: use 0.5 for process temperature up to 600 °C. For processes above 600 °C, use a coefficient value of 1.

Gas line flow setpoints: from 0 to 2000 sccm for argon, forming gas and oxygen.

Primary vacuum: if checked, the vacuum valve will be opened.

Open purge valve: if checked, the purge valve will be opened to let nitrogen flow. No control is possible on the flow.

Comment: a comment can be entered with an unlimited number of characters


  • Each step can be edited thanks to the step browser buttons on the right side of the box: "Previous step", "Next step", "First step" and "Last step". Blank steps can be added before the current selected step with "Insert step". "Delete step" will delete the selected step screen. "Fill page" will copy each parameter's value from the previous step.
  • When all the parameters are set, press the button "Display recipe". A new screen is displayed with a graph window for temperature as a function of time for each step. This is useful to verify fast the parameters set in the recipe.

Thermal profile

  • Exit the window and modify the parameters if needed.
  • Press the button "Save recipe" then exit.

Note: To create a new recipe from zero, you can also click "New" in the recipe manager then create and edit steps.


Loading the PID table

PID temperature controller

  • Click “PID temperature controller” in the upper left corner to see the active temperature display.
  • Click "Browse" and load the calibration table according to the temperature control mode and the wafer size used for the process.
  • Click "Apply all yellow setpoints". Make sure that the PID values for all temperature zones (300, 400, 500, 600, 700, 800, 900 and 1300 °C) are loaded properly.
  • Exit the window.
Warning: Not using the right PID table can lead to a temperature control failure. 


  • Click "Processing" in the main interface.
  • Select the recipe to download and click "Download".

Download recipe

  • Press "Start Processing". The system will ask for sample loading.

Important note: it is recommended  to do at least one dummy run for chamber conditioning and recipe testing. If there is any issue, contact the staff.

Warning: Make sure that a silicon wafer is loaded in the chamber. If not, the equipment could be seriously damaged.
  • The screen will display the process monitoring window with all the parameters: recipe name, current step, calibration table name, setpoint, temperature readings, lamp power, gas flow readings.
  • The process can be stopped at any time by using key "Stop".
Warning: if the difference between the setpoint and the temperature measured is over 75 °C, the system will display an alarm and will stop the process. Contact the staff if the problem occurs.

End of Process

  • At the end of the process, cooling starts automatically for 240 s. The time is displayed on the left side of the main interface.
  • During the cooling time, save the process monitoring as a historical file. Select your folder in "Historicals" directory and type your name in "Operator" field. Click "Save" and exit.

Process saving

  • At the end of the cooling step, open the lid of the reactor and remove your sample.
  • Check if there is any trace of contamination (whitish color) on the wafer or on the reactor platen (underneath the wafer). Contact a staff member immediately in case of contamination.
  • Put the default wafer back in the reactor if you use yours.
Warning: The chamber remains closed until the temperature is below 100 °C.