Make:
EVGroup
Model:
EVG620
category:
Lithography
contact:
jun.li@mcgill.ca
location:
Litho room
install:
Fri, 11/01/2002
Coral Name:
evg620
Description:
150mm compatible aligner.
Down 0.8um in resolution
1um topside alignment OPERATION MANUAL
Performance of the Tool
What the Tool CAN do
- Interchangeable mask frame and bond tools permit alignment of mask-to-wafer or wafer-to-wafer.
- Frontside mask-to-wafer alignment accuracy to <0.6 microns.
- Precision front-to-backside alignment to < 1 micron.
- Four different mask exposure modes: proximity, soft- and hard- contact, and vacuum contact.
- Fully motorized, split field microscopes with multiple objectives for wafer top and bottom side viewing.
- Backside alignment modes: optical image capture, user-specified cross-hairs, or customized alignment keys.
- Near UV (350 - 450 nm) lamp source.
Operating Procedures for Frontside Alignment
Function Overview: Optical lithography contact/proximity aligner-bonder
- 5 exposure modes: vacuum contact, vacuum hard, hard contact, soft contact, and proximity
- frontside and backside alignment
- objectives available: 10X, 20X, 50X, and flat objective (for pieces)
- bonding chucks for anodic bonding, thermal compression bonding and fusion bonding.
- 2" chuck can be used for 2" wafers and pieces as well
- minimum resolution in dark field = 0.7 µm line and <1 µm contacts
- minimum resolution in clear field = 2 µm line and 2 µm contacts
- 2", 4" and 6" wafers, 3", 5" and 7" masks
- max wafer thickness 4.6 mm
Special Notes or Restrictions:
- This machine allows most materials.
- Clean front and back of mask before use
- Clean mask every one to five wafers
Startup
- Do not touch the power supply, it is always on!
- PC Power is left on
- Click icon ev620
- OR if already there click on login and enter "engineer" for name and enter "recipe" for password
- Initialization begins.
- You need to make sure that the chuck is centered as much as possible to the mask holder. You can start by putting the micrometers x, y, and theta to the graduation 5 (groove)
- If necessary change chucks, mask holder and loading frames. Manipulation of chucks and mask holder must be done with extra care. The bottom surface of those pieces are extremely flat and any degradation will lead to lower performances of
the aligner. - Open the desired recipe. In the STANDARD RECIPE folder you'll find standard programs.
| Process Name | What it does |
- Double click on the process you want. These processes are standard processes; only change exposure dose, alignment gap (40 µm is recommended for standard wafers; adjust the alignment gap based on your wafer and resist thickness) and other necessary changes. Do not save the changes!
- Click "Run"
- ->Save changes? NO (use them for your process only, do not change the program permanently). Changes can be saved when the recipe has been saved under your name.
Load Mask
- ->Insert Mask Holder (this should already be in place, make sure it's firmly pressed down)
- press <CONTINUE>
- ->Insert Mask with load frame and press <continue> (mask frame loaded with tab on right).
- Load chrome side down and the wafer flat side to the right
- ->Please Wait
- ->Move tray in
- -> Bring stage to center position. Use the micrometer knobs (x, y and theta) to bring the stage to center (graduation 5 on the ruler)
- ->Please Wait (Wedge Error Compensation
- -> Optics autofocus (the optics are automatically placed at the position they were the last time the process was run)
- ->Adjust Mask (at this time the mask holder is at 50µm of the mask)
- To adjust targets of the mask, you use split field microscope.
- Press "Scan Optic" in the "Position-Menu" and you can move the microscopes with the joystick in x y and z direction (small motions give slower responses). For x and y push forward back or right or left, for focus rotate clockwise or counter clockwise.
- To adjust for rotation use the micrometer screw ( since the mask is not yet attached by vacuum)
- When targets have been found and focused press "CONTINUE". (to attach mask with vacuum)
- Press “Controls” for contrast and brightness tuning. Use only Gain 0, 1 or 2.
- ->Please Wait
- ->Move <TRAY OUT>
- ->Remove loadframe and press <CONTINUE> (remove the loadframe and put it back in the rack)
- ->Insert substrate and press <CONTINUE>(to activate vacuum) (OR press EXIT to unload mask)
- If vacuum contact is used, install the seal around the chuck
Load wafer
- Warning if you chose "Exit", you must unload mask (when asked "Do you want to unload mask" - answer yes).
- Check vacuum.
- ->Move tray in
- ->Please wait (wec is performed)
- -> Optics autofocus (the optics are automatically placed at the position they were the last time the process was run)
-
->Adjust wafer using the 3 micrometer spindles (x axis, y axis and theta)
- This is the ONLY time during the process where it is possible to modify the process parameters (contact
mode, exposure time/energy, separation distance, etc…) - Click on Scan Optics.
- Note the screen will go out of focus because the mask was loaded, just adjust it (using the joystick).
- Right click in video screen, opens a contextual menu allowing you to choose from Left field only, Right field only or Split field.
- Adjust your wafer to align it to the mask using the micrometer knobs
- Press "Sep/Cont" button to go in and out of contact to check alignment and readjust (contact has the light off button and separate has the light on).
- When satisfied with alignment you must remember to leave it in contact mode (if not poor exposure will result
- This is the ONLY time during the process where it is possible to modify the process parameters (contact
- Press <CONTINUE> when wafer is aligned
- ->Please wait
- If vacuum contact is selected you will be given the option of pressing continue to expose OR pressing Undo if you want to do more alignment (view is of wafer in vacuum mode - last chance to back out before exposure)
- Exposure time/dose is announced and exposure begins. (to stop exposure press on the joystick button for 2 sec and release)
- ->Please Wait
- ->Move tray out
- ->Remove substrate and press CONTINUE.
- ->Insert substrate and press CONTINUE.
- Now either load a new substrate or see below to unload the mask.
-
Do not disable the EV aligner before completely finishing the following Shutdown Procedure! Otherwise the system will jam!
Shutdown Procedure
- Click "EXIT" or"UNDO" to unload mask.
- ->Insert load frame and move tray in
- ->Please Wait
- ->Move tray out
- ->End of process - remove load frame
- Click on EXIT
- Select Park. Move tray in? Click on yes and move the tray in.
- Leave Key ON
- Leave PC Power on.
- Click on Logout
- Disabled "evalign" (log resist type, thickness, exposure time, result on log sheet)
Button Information
| Button | Description |
| Limits | Choose Scan Optic |
| Scan Optic |
To move with the split field microscope. In addition you see the minimum, maximum and actual value of the left and the right microscope in X, Y and Z direction. With "Store Optic Pos" you can store the actual optic position. With "Load Optic Pos" you can load a stored optic position. |
| Recipe | To set process data during the process |
| Controls | To change the cross data and overlay intensity (in case of topside alignment you do not have a cross.) |
| continue | Usually acknowledges previous choice or that what is on screen is done. Also may push <ENTER> button for same result (button with arrow down and to the left) |
| enter | Confirms data entry |
| Track Ball | Used for PC control |
| Joystick | Adjust split field microscope in X and Y (right and left, forward and back)and to focus (rotate clockwise or counterclockwise). Speed controlled by slow or fast movements. |
| L/R: | To change between left and right objective |
| Sep/Cont: | To change between separation and contact |
| Undo: | If you have a problem press "Undo" to go one process step back, and follow instructions on screen. |
| Stop: | To stop the process |
| Exit: | To leave the process |
| Wec Force: | Check pressure during WEC only, cover weight can be adjusted.(0.4 bar) |
| Exposure Force: |
Check pressure during align phase (0.5 bar). |
| Chuck Weight: | Is actual pressure during WEC (270 -300 mbar) |
| Hard Contact: | When hard contact mode is selected you can adjust N2 pressure (0.5 bar) |
Process notes:
Special Notes:
How to restart the lamp if it's off. This procedure is reserved to experimented users only.
-
Get out of the process window by pressing exit and close the EVG620 software
-
Turn off the electronics using the key switch located at the front of the tool (DO NOT TURN OFF THE MAIN RED SWITCH)
-
Turn off and back on the lamp power supply located underneath the tool
- The left needle indicator should display 100V
- Press Start for 1 sec and release
- The left needle indicator should go to 30V and will slowly increase up to 65-70V
- Wait 10-15min for lamp power to stabilize
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