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Getting Started

Facility
Capabilities

Rates

Equipments List

Chemicals available

Policies

Portfolio

Equipments
Direct Writing

Lithography
EMS 1000-1 hot plate

EVG101 Spray Coat

EVG620 Contact Aligner

Isotemp Oven

Laurell Spin Coater

Laurell developing station

OAI aligner

Site Coater

Yes Oven

Chemical Vapor Deposition
GEMStar-8™

LPCVD

PECVD

Parylene

Physical Vapor Deposition
Denton RF/DC Sputter

MRC 603 Sputter

NexDep Ebeam Evaporator

BJD1800 Ebeam Evap

Dry Etching
DRIE

DSB6000 oxygen asher

Xactix XeF2

RIE P5000

Wet Benches
HF wet bench

Litho Bench

Non-HF Acid wet bench

Solvent bench

bulk silicon Etch

Annealing and Oxidation
Jetfirst 200 RTP system

Wet and Dry Oxidation

Wet and Dry Oxidation2

Metrology and Characterization
SEM VEGA3

Ambios Profiler

Flexus Stress

Nanospec

Optical Microscope

VAS Ellipsometer

Wyko Optical Profiler

Wafers bonding, Sawing and Packaging
Disco DAD3240 Wafer Saw

EVG501 wafer bonder

Polisher

Wire Bonder

Processing
Material Available in the Microfab

Baseline Processes
Annealing and Oxidation

Photolithography

Wafer Bonding

Electrolithography

Chemical Vapor Deposition

Dry Etch Process
Reactive Ion Etching

Thin Film Deposition

Wet Processing

Integrated Processes
Glass channels

ITO lift-off

PDMS molding

Process Monitoring
Denton Rates

LPCVD PolySilicon

MRC 603 Sputter Rates

Metrology Monitoring

Process clinic

Articles of interest

Books

Coral
Remote Coral

Coral Training Screencasts

Inventory Levels

Coral How-To

Requests

Links

Contact

Alumni

Home » Processing » BaseLine Processes

Dry Etch Process

Oxide Etch Recipe: NANOTOOLS OXIDE ETCH

Polysi Etch: NANOTOOLS POLY ETCH

Aluminum Etch Study: NANOTOOLS AL ETCH

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Processing

Materials Available in the Microfab
BaseLine Processes
Integrated Processes
Process Monitoring
Process clinic
Articles of interest
Books