Denton Sputter Rates

Gold deposition

Results for Denton E14 Gold deposition monitoring with Recipe AU-MON1-PH Pressure = 5 mTorr DC1 = 0.2 Amperes RS = 50% Heat = NO Measurement Method = Profilometry of scratch test on glass slide

DATE TIME (sec) THICKNESS (A) RATE (A/sec) Comments
20-Mar-09 417 1259 3.02  
31-Mar-09 723 3022 4.18  
05-May-09 723 3093 4.28  
07-Jul-09 100 422 4.22  
28-Aug-09 300 1053 3.51  
28-Jan-10 300 1033 3.44  
26-Apr-10 300 1175 3.92  
09-Jun-10 600 2139 3.57  
20-Aug-10 300 1379 4.59 New Target
24-Mar-11 300 1450 4.8  
20-Jun-11 300 1280 4.26  
07-Oct-11 300 1220 4.06  
13-Dec-11 300 1200 4.00  
26-Jan-12 300 1200 4.00  
19-July-16 900 3400 3.8  

Titanium Deposition

Results for Denton E14 Titanium deposition monitoring with Recipe TI-MON1-PH Pressure = 8 mTorr DC2 = 0.6 Amperes RS = 50% Heat = NO Measurement Method = Profilometry of resist pen test on glass slide

DATE DEP TIME (sec) DEP THICKNESS (A) RATE (A/sec)
5-May-09 600 1093 1.82
7-Jul-09 600 856 1.43
26-Aug-09 900 1366 1.52
28-Jan-10 900 1414 1.57
26-Apr-10 660 1143 1.73
09-Jun-10 660 1118 1.69
20-Aug-10 300 406 1.35
30-Mar-11 600 1000 1.66
06-oct-11 600 1200 2
26-Jan-12 600 1053 1.75
 04-Aug-14  600  1200 2
19-July-16 600  1200

 

Chromium Deposition

Results for Denton E14 Chromium deposition monitoring with Recipe CR-MON Pressure = 5 mTorr DC2 = 1 Amperes RS = 50% Heat = NO Measurement Method = Profilometry of resist pen test on glass slide

DATE DEP TIME (sec) DEP THICKNESS (A) RATE (A/sec)
2011-03-24 600 3500 5.8
       
       
       
       
       
     

Al Deposition using RF cathode

Recipe:  Pressure = 8 mTorr RF = 400W RS = 50% Heat = NO Measurement Method = Profilometry of resist pen test on glass slide

DATE DEP TIME (sec) DEP THICKNESS (A) RATE (A/sec)
2016-04-08 600  1100 1.8

Ag Deposition using RF cathode

Recipe:  Pressure = 15 mTorr RF = 400W RS = 50% Heat = NO Measurement Method = Profilometry of resist pen test on glass slide

DATE DEP TIME (sec) DEP THICKNESS (A) RATE (A/sec)
2016-05-30 1000  6000 6

Ag Deposition using RF cathode

Recipe:  Pressure = 10 mTorr RF = 200W RS = 50% Heat = NO Measurement Method = Profilometry of resist pen test on glass slide

DATE DEP TIME (sec) DEP THICKNESS (A) RATE (A/sec)
2016-07-19 1200  4200 3.5

Mo Deposition

Recipe: Recipe CR-MON Pressure = 10 mTorr DC2 = 1.1 Amperes RS = 50% Heat = NO Measurement Method = Profilometry of resist pen test on glass slide

DATE DEP TIME (sec) DEP THICKNESS (A) RATE (A/sec)
2012-08-01      

ITO Deposition

Recipe ITOCOLD P = 4.9 mT RF Source= 200W Bias Forward Power = 20 W Heat = No RS = 50%. O2/Ar= 3/100 (gas flow: ~1.4/70.4sccm) Measurement Method = Profilometry of Resist pen on glass slide. 4PP = manual 4point probe.

DATE DEP TIME (sec) DEP THICKNESS (A) RATE (A/sec) 4PP (ohm/sq) Comments
28-Aug-09 1000 623 0.62  
9-Jun-10 1600 983 0.61  
18-Jun-10 1600 2700 1.69   Reflected RF minimized
20-Aug-10 600  1062 1.77 150  
12-Jun-11 2400 3586 1.52 30-36  
06-Aug-12 650 1250 1.92 125  
09-Jun-2016 1000 1270 1.27    

ecipe ITO-20-OHMS P = 4.9 mT RF Source= 200W Bias Forward Power = 20 W Heat = 300C RS = 50% O2/Ar: 2%Measurement Method: deposit on a Si`SiO2 and a glass sample=> Ellipsometry on Si/SiO2 sample for thickness. 4PP = manual 4point probe on glass for Sheet resistance. Photometryon glass for transmission spectra.

DATE DEP TIME (sec) DEP THICKNESS (A) RATE (A/sec) 4PP (ohm/sq) Transmission Spectra Comments
9-Jun-2011 2400 3668+-10 1.52  10-12 graph
16-Jun-2011 2400 3233 1.34 17-21