Capabilities

The McGill Nanotools - Microfab is a 150mm compatible MEMS fab. It is equipped with standard and specialized semiconductor equipments. The capabilities of the Nanotools - Microfab can be described as follow:

  • Lithography:
    • Contact Broadband UV (<1um)
    • Electron Beam (<30nm)
    • Direct UV laser write (1um)
    • Thermal probe AFM lithography
  • Thin films:
    • LPCVD Nitride and polySilicon (SiN, aSi, PSi)
    • Thermal Oxides (SiO2)
    • Ebeam Evaporator (Ag,Ni,Au,Ti,Cr,Pd,Pt,Al,SiO2,SiO,ITO...)
    • DC and RF sputterer (SiO2,SiN,ITO,Ti,Cr,Mo,Zr,Au,SiC...)
    • Spin and spray coater
    • Parylene C
  • Dry etching:
    • DRIE
    • RIE (HBr, Cl2, CF4, CHF3, SF6, O2, Ar...)
    • XeF2 isotropic Etch
  • Wet benches
    • Solvents (Ultrasonic bath)
    • Acids etching (HF, H3PO4,HNO3,HSO2...)
    • Acids cleaning (Piranha, Nanostrip, RCA1, RCA2)
    • Silicon bulk etch (TMAH and KOH)
  • Packaging and other processes:
    • Wafer bonder (Anodic, Direct, Adhesive Eutectic)
    • Dicing saw
    • Polisher
    • Laminator
    • WireBonder
  • Characterization
    • LaB6 filament SEM. up to 150mm wafer
    • optical microscope with nomarski prism
    • stylus mechanical profilometer
    • white ligth interferometry non contact profilomter
    • reflectometer for transparent thin film
    • spectroscopic ellipsometer